Process
From the first feasibility memo to FOTA patches three years after launch — one team, one accountable timeline.
Six steps. One supplier. One accountable team.
Most of our European customers are tired of stitching together a Shenzhen ODM, an EU compliance lab, and a fulfillment 3PL. We do the first two and integrate with the third.
- 01
Discovery
Week 1We discuss product requirements and functional specifications, clarify expected sales volume and cost targets, and deliver a feasibility memorandum within the first week.
- 02
Architecture
Week 2–3Block diagram, module selection, MCU & sensor shortlists, antenna and power budgets, mechanical concept. Reviewed against a compliance checklist.
- 03
EVT prototype
Week 4–7First PCBA + tooled enclosure. Firmware up to bring-up. Internal field testing and RF pre-scan in our anechoic chamber.
- 04
DVT & certification
Week 8–12Design validation against your spec. CE, FCC, RED 3.3(d/e/f), ETSI EN 303 645, RoHS, REACH submitted in parallel.
- 05
Mass production
Week 13+PVT, then ramp. SMT, assembly, programming, calibration, packaging in our Shenzhen line. ISO 9001 / 14001 audited.
- 06
Sustaining
OngoingFOTA fleet management, field RMA, BOM watch, EOL tracking, security patches. We stay on the hook for the life of the product.
A real factory, not a forwarding address.
Our Shenzhen facility is ISO 9001 / 14001 certified. Two SMT lines, two assembly lines, RF pre-scan chamber, IPX/IK drop testing, climate aging chambers, and a small-batch tooling shop.
